AI, next gen chips and sustainable process solutions: Reflecting on Semicon Taiwan 2024
September 09, 2024
This year’s Semicon Taiwan was all about breaking limits to power the AI era. The entire industry is focused on developing the next generation of chips to meet AI's demands, while also exploring sustainable process solutions that balance the increased power consumption. At Comet, breaking these limits means not only advancing cutting-edge technology but also investing in current and future talent.
The growing Semicon Taiwan
Our team was amazed by the remarkable growth of Semicon Taiwan in recent years – what once occupied two halls now spans four halls across two buildings. This expansion was felt everywhere, with many visitors frequenting the hallways and stopping by the Comet booth to discuss semiconductor manufacturing and see how our products improve both front- and back-end processes in the industry.
We broadened our horizons at the many interesting presentations and keynotes from industry experts. We were also inspired by the community's engagement during our own keynotes on X-ray technology for Advanced Packaging. A big thank you to everyone who attended and contributed to the insightful discussions that followed.
«Words can hardly capture the vibe and energy of Semicon Taiwan, which truly reignites excitement for the semiconductor industry. It’s inspiring to be here, at the very heart of semiconductor innovation, pushing the boundaries of technology.»
Isabella Drolz, VP Marketing & Product Strategy, X-ray Systems division
Advancing AI with AI
At Comet, in line with Semicon Taiwan’s theme of "Breaking Limits: Powering the AI Era", our goal is to facilitate and accelerate the go-to-market cycle for the next generation of AI chips in a sustainable manner. AI has become an indispensable tool for our engineers, not only for testing new developments but also as a key component of our products. Our X-ray inspection software powered by Dragonfly, uses AI to analyze, and address structural defects in advanced packaging, leading to higher yields, less waste, and faster development and production phases.
![{"shape": [2702, 3840, 3]}](https://brand.comet-group.com/m/4e3524a76270daaf/webimage-3DX-ray_CA20_Semi_CPU_2023_037_CMYK.png)
Synertia®: the importance of a completely integrated RF platform
The live demo of Synertia®attracted many partners and fellow engineers, once again proving the critical importance of harmonized components in controlling plasma processes. The Synertia® RF Power Delivery Platform seamlessly integrates generator, matchbox, and vacuum capacitors for real-time insights into plasma processes, enabling faster problem-solving and quicker product launches. Our Comet PCT experts were thrilled to discuss custom specific needs and advise in how Synertia® is able to improve the analysis and control of the plasma.
X-ray inspection systems & software – a must in Advanced Packaging
In the nano-scale world of advanced packaging, precision is key. Comet Yxlon’s CA20 X-ray solution is specifically designed to help manufacturers detect and resolve issues with unmatched accuracy, enabling faster operations and higher yields. Our interactive Discovery Desk at the booth allowed visitors to explore the capabilities of X-ray inspection firsthand, sparking a lot of interest. We were excited to see such strong engagement with both our X-ray systems from Comet Yxlon and our X-ray tubes and components from Comet X-ray.
Final thoughts
As we wrap up our experience at Semicon Taiwan 2024, we are more motivated than ever to push the boundaries of what’s possible in the semiconductor industry. The innovation and enthusiasm we witnessed here reinforce our commitment to driving the AI era forward, while also maintaining a strong focus on sustainability and talent development. We’re excited to continue building on the connections we made and the insights we gained to shape the future of technology.
Don’t miss us in Munich
November 12-15 2024, Messe München, Munich, Germany
The team is looking forward to meeting our partners and exchange on best practices at the front- and backend of semiconductor manufacturing.
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