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Glass is attracting increasing attention as a substrate material for advanced semiconductor packaging. Its dimensional stability and electrical properties make it an interesting basis for large-area panels and high-density interconnect structures. But when electrical connections are routed through the glass using through-glass vias (TGVs), a new inspection challenge emerges: many of the relevant defects are no longer visible from the surface. At Photomask Japan 2026, we presented our first imaging examples for glass substrates and TGV structures. The results show how X-ray imaging can provide non-destructive access to defects in etched glass vias and metallized TGVs — and why tilted radiography, computed laminography, detector performance, and AI-assisted analysis all matter.

Earlier this year, we had the chance to collaborate with the Fraunhofer Research Institution for Individualized Medical Technology and Engineering IMTE (Fraunhofer IMTE) and the Leibniz Centre for Archaeology (LEIZA) on a unique find within an Aurochs skull unearthed at the oldest known grave in northern Germany – The Duvenseer Moor in Schleswig Holstein.

During a recent three-week student internship at Comet Yxlon, I had the chance to mentor a 9th-grader who was curious, motivated—and (for good reasons) not allowed to operate X-ray equipment independently. So we designed a project that would still feel real: hands-on data, real analysis, and a clear outcome. The goal was to let her work independently in software while learning the basics of X-ray imaging and computed tomography.