Blog – X-ray & CT Insights

Glass is attracting increasing attention as a substrate material for advanced semiconductor packaging. Its dimensional stability and electrical properties make it an interesting basis for large-area panels and high-density interconnect structures. But when electrical connections are routed through the glass using through-glass vias (TGVs), a new inspection challenge emerges: many of the relevant defects are no longer visible from the surface. At Photomask Japan 2026, we presented our first imaging examples for glass substrates and TGV structures. The results show how X-ray imaging can provide non-destructive access to defects in etched glass vias and metallized TGVs — and why tilted radiography, computed laminography, detector performance, and AI-assisted analysis all matter.