Need for Speed: Boosting X-ray Inspection Speed in Advanced Electronics
As electronics become more powerful and advanced packaging technologies more complex, manufacturers face the challenge of detecting ever-smaller defects without reducing throughput. Optical inspection methods cannot reveal the buried structures found in high-power electronics, chiplets, HBM, through glass vias (TGVs), and advanced 3D packages. X-ray inspection and automated X-ray inspection (AXI) provide the required visibility, but higher resolution and penetration have traditionally come at the expense of speed. Recent advances in micro and nano focus X-ray source technology are overcoming this trade-off by delivering higher photon flux, improved contrast-to-noise ratio, and faster imaging. In this post we review these developments in high-power electronics, where higher voltage and power are required to penetrate through dense structures while maintaining micro-scale imaging, and advanced packaging where increasing complexity from vertical integration and sub-micron resolution combine. We highlight how increased throughput can be achieved while maintaining reliable defect detection.
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